HAD812i
产品分类:
产品分类02
- 产品描述
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规格参数
1.系统功能/System Function
UPH
MAX 17K(Depending On Die Size And Holder)
固晶精度/Accuracy
Standard:±20μm @ 3σ
With uplook:±10μm @ 3σ
晶片旋转/Die Rotation
Standard: 芯片尺寸≥1mm:±1°,芯片尺寸<1mm:±2°
With uplook:芯片尺寸≥1mm:±0.5°,芯片尺寸<1mm:±2°
2.晶片XY工作台/Die XY Workbench
晶片尺寸/Die Dimensions
15mil×15mil-200mil×200mil(0.38mm*0.38mm-5.08mm*5.08mm)
晶片最大角度修正/Max. Angle Correction
±15°
适用晶片铁环尺寸/Max. Die Ring Size
外径(External Diameter):400mm 内径(Inner Diameter):350mm
最大晶圆面积尺寸/Max. Die Area
12″(Expanded)直径320mm(扩张后)
分辨率X/Resolution X
0.04mil (1μm)
分辨率Y/Resolution Y
0.04mil (1μm)
顶针Z高度行程/Thimble Z Height Stroke
3mm
3.点胶XY工作台/Dispenser Work table
分辨率X/Resolution X
0.04mil (1μm)
分辨率Y/Resolution Y
0.04mil (1μm)
分辨率Z/Resolution Z
0.04mil (1μm)
4.图像识别系统/Image Recognition System
灰阶度/Grey Scale
256级灰度(Level Grey)
分辨率/Resolution
720×540像素(Pixels)
5.吸晶邦头机械手系统/Die Bonder’s Swing Arm-and-hand system
直线旋转邦头/Die Bonder
直线电机往复固晶,邦头旋转/linear motor reciprocate die bonding
吸晶压力/Die Bond Pressure
30-300gf (±5gf)可选配3000g
6.适用框架尺寸/Suitable Holder’s Size
框架长度/Length
110mm ~ 300mm
框架宽度/Width
30mm ~ 110mm
框架厚度/Thickness
0.12-1.2mm
7.所需设施/Facilities Needed
电压/频率/Voltage/Frequency
220V AC±5%/50HZ
压缩空气/Compressed Air
0.5MPa(MIN)
额定功率/Rated Power
1500W
耗气量/Gas Consumption
40L/min
适用铁环/晶圆Suitable Iron ring/ wafer
标配 14寸铁环(12寸晶圆)/Standard Equipped with 14″Iron Ring ( 12″ )Wafer
可兼容 10寸铁环(8寸晶圆)/Compatible with 10″Iron Ring ( 8″Wafer)
适用针筒规格Suitable Barrel Spec.
标配10CC(可兼容5CC和30CC)/Standard Equipped with 10CC, (Compatible with 5CCand 30CC)
8.体积及重量/Volume and Weight
长x宽x高/Length x Width x Height
230×150×200cm(加三色灯)
重量/Weight
1570KG
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