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产品详情
(周期: 120ms) 适合于矩阵式粘胶工艺的IC支架,如DFN/QFN系列、SOP系列
1.点胶模组可扩展性适应客户支架;高达4组点胶针头,大大提高了点胶效率,每组点胶机构X/Y/Z向可调整方便调试维护; 2.采用线性电机驱动搜寻晶片平台(X/Y)与送料平台(B/C); 3.wafer table自动校正芯片位置; 4.自主研发工控机控制系统,简单易操作&维护; 5.流量式芯片真空检测,稳定可靠; 6.自主研发视觉系统for pre-bond/pos-bond,稳定可靠; 7.材料/产品的全自动载入载出,高生产效率的保证; 8.固晶位置精准及优良的一致性,高品质产品的保证; 9.节拍:120毫秒/点,实际产出取决于芯片尺寸和支架上产品的密集度; 10.bondforce参数化调整,稳定可靠。 HAD816-B(Automatic High-speed Die Bonder) (Cycle: 120ms) It is compatible with IC leadframe of matrix viscose process, such as DFN/QFN series, SOP series.
1. The dispensing module is expandable to adapt to customer support; up to 4 sets of dispensing needles, greatly improving the efficiency of dispensing. The Dispensing mechanism of each set can be adjusted in X/Y/Z direction for convenient debugging and maintenance. 2. Using linear motor to drive the search chip platform (X/Y) and the feeding platform (B/C); 3. Wafer table automatically corrects the position of the chip; 4. Independently developed industrial computer control system, easy to operate and maintain; 5. Flow type chip vacuum detection, stable and reliable; 6. Independently developed visual system for pre-bond/ pos-bond, stable and reliable; 7. Fully automatic loading and unloading of materials/products, ensuring high production efficiency; 8. Precise location of die bonding and excellent consistency, guarantee high quality products; 9. Beat: 120 ms/point, actual output depends on chip size and density of products on the bracket; 10. Bondforce parameterized adjustment, stable and reliable. |
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