GTS100BH-PA

GTS100BH-PA

Plane-type High-speed Die Bonder

Cycle: 50ms

It is compatible with SMD020, 1010, 2121, 2835, lamp filament, and COB etc.

Product Features

1.      International leading double die bond, double adhesive dispense and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Crystal frame automatic correction chip structure is also applied;

5.      Programmed control constant-temperature adhesive dispensing system is also applied;

6.      Vacuum die missing testing technology is adopted;

7.      Automatic loading and unloading system is applied to saving the time of reloading;

8.      Automatic installing & uninstalling crystal rings is applied to improve the production efficiency largely;

9.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

10.   Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

11.   Precise die bond location and excellent compatibility will guarantee the back-end processing.