|
|
|
Details GTS100AH-N Plane-type High-speed Die Bonder Cycle: 50ms It is compatible with 2121、3014、2835 and 5050 etc.
1. International leading double die bond, double adhesive dispense and double die searching system; 2. Linear motor is applied to drive bond head; 3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C); 4. Programmed control constant-temperature adhesive dispensing system is also applied; 5. Vacuum die missing testing technology is adopted; 6. Stacking holders for loading (free-loading magazine) is applied to improve the production efficiency largely; 7. IPC will control the operation of equipment, simplifying the operation of automation equipment; 8. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness; 9. Precise die bond location and excellent compatibility will guarantee the back-end processing.
|
|