GT836M

GT836M

Plane-type High-speed Die Bonder

Cycle: 180ms

It is compatible with digital products, dot matrix, high power, COB, and SMD etc.

Product Features

1.        It is the best choice for full-automation die bond of planar LED lights;

2.        High-speed die bond(180ms/piece, 20K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

3.        Precise die bond location and excellent compatibility will guarantee the back-end processing;

4.        Linear motor is applied to drive bond head;

5.        New touch-type deep detection system is applied to control the swing arm, solving the bonding issues caused by the non-uniform height of PCB or holder effectively;

6.        Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

7.        Programmed control constant-temperature adhesive dispensing system is also applied;

8.        Vacuum die missing testing technology is adopted;

9.        IPC will control the operation of equipment, simplifying the operation of automation equipment.