HAD816-B

HAD816-B（Automatic High-speed Die Bonder）

（Cycle: 120ms）

It is compatible with IC leadframe of matrix viscose process, such as DFN/QFN series, SOP series.

Model Features

1. The dispensing module is expandable to adapt to customer support; up to 4 sets of dispensing needles, greatly improving the efficiency of dispensing. The Dispensing mechanism of each set can be adjusted in X/Y/Z direction for convenient debugging and maintenance.

2. Using linear motor to drive the search chip platform (X/Y) and the feeding platform (B/C);

3. Wafer table automatically corrects the position of the chip;

4. Independently developed industrial computer control system, easy to operate and maintain;

5. Flow type chip vacuum detection, stable and reliable;

6. Independently developed visual system for pre-bond/ pos-bond, stable and reliable;

7. Fully automatic loading and unloading of materials/products, ensuring high production efficiency;

8. Precise location of die bonding and excellent consistency, guarantee high quality products;

9. Beat: 120 ms/point, actual output depends on chip size and density of products on the bracket;

10. Bondforce parameterized adjustment, stable and reliable.