HAD810

HAD810

Automatic Plane-type Die Bonder

Cycle: 220ms

It is compatible with IC frame

1.    Linear motor is applied to drive double adhesive dispensing bond head;

2. High precision linear driving die bond tieback, voice coil torsion loop controls die bond pressure accurately;

3. High-precision die platform searching, servo motor driving die angle correction system, equipped with automatic film expansion system;

4.    A separate dispensing control system is adopted to make a precisely control of dispensing amount;

5.     Vacuum die missing testing technology is adopted;

6.    IPC will control the operation of equipment, simplifying the operation of automation equipment;

7.    Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance your enterprise’s competitiveness.